Version 1.1 of the definition has been released. Please help updating it, contribute translations, and help us with the design of logos and buttons to identify free cultural works and licenses!

Abuse filter log

Abuse Filter navigation (Home | Recent filter changes | Examine past edits | Abuse log)
Jump to navigation Jump to search
Details for log entry 159,429

02:33, 4 January 2019: PCB Assembly (talk | contribs) triggered filter 0, performing the action "edit" on User:PCB Assembly. Actions taken: Disallow; Filter description: (examine)

Changes made in edit

 
Outer layer copper thickness necessities ought to be reviewed as trace dimension and spacing decrease below 5-6 mils. The designer ought to attempt to utilize a copper callout to satisfy the electrical necessities additionally as take into account manufacturability of the PCB. A general rule is ([1 oz. copper]https://www.allpcb.com/pcb_copper_thickness.html?code=P9 being nominal) as circuit density will increase, copper weight ought to decrease. as an example, a four mil trace and house style ought to utilize [*fr1] ounce copper for external layers where doable.
Theoretically, PCB (Printed Circuit Board) current carrying capability is decided by cross-sectional space of trace and temperature rise. moreover, cross-sectional space of trace is directly proportional to trace dimension and copper thickness. Well, here comes a question: will this rule conjointly apply to the link between current carrying capability and trace cross-sectional space, that is, is trace carrying capability directly proportional to its cross-sectional area? underneath an equivalent temperature rise that's 10°C, a 10mil-trace with 1oz copper weight is capable of withstanding current of 1amp at the most and that we rest assured that a 50mil-trace is capable of withstanding current larger than 1amp.

Action parameters

VariableValue
Whether or not the edit is marked as minor (no longer in use) (minor_edit)
false
Name of the user account (user_name)
'PCB Assembly'
Age of the user account (user_age)
164
Page ID (page_id)
0
Page namespace (page_namespace)
2
Page title (without namespace) (page_title)
'PCB Assembly'
Full page title (page_prefixedtitle)
'User:PCB Assembly'
Action (action)
'edit'
Edit summary/reason (summary)
'1 oz Copper Thickness'
Old content model (old_content_model)
''
New content model (new_content_model)
'wikitext'
Old page wikitext, before the edit (old_wikitext)
''
New page wikitext, after the edit (new_wikitext)
'Outer layer copper thickness necessities ought to be reviewed as trace dimension and spacing decrease below 5-6 mils. The designer ought to attempt to utilize a copper callout to satisfy the electrical necessities additionally as take into account manufacturability of the PCB. A general rule is ([1 oz. copper]https://www.allpcb.com/pcb_copper_thickness.html?code=P9 being nominal) as circuit density will increase, copper weight ought to decrease. as an example, a four mil trace and house style ought to utilize [*fr1] ounce copper for external layers where doable. Theoretically, PCB (Printed Circuit Board) current carrying capability is decided by cross-sectional space of trace and temperature rise. moreover, cross-sectional space of trace is directly proportional to trace dimension and copper thickness. Well, here comes a question: will this rule conjointly apply to the link between current carrying capability and trace cross-sectional space, that is, is trace carrying capability directly proportional to its cross-sectional area? underneath an equivalent temperature rise that's 10°C, a 10mil-trace with 1oz copper weight is capable of withstanding current of 1amp at the most and that we rest assured that a 50mil-trace is capable of withstanding current larger than 1amp.'
Unified diff of changes made by edit (edit_diff)
'@@ -1,1 +1,2 @@ - +Outer layer copper thickness necessities ought to be reviewed as trace dimension and spacing decrease below 5-6 mils. The designer ought to attempt to utilize a copper callout to satisfy the electrical necessities additionally as take into account manufacturability of the PCB. A general rule is ([1 oz. copper]https://www.allpcb.com/pcb_copper_thickness.html?code=P9 being nominal) as circuit density will increase, copper weight ought to decrease. as an example, a four mil trace and house style ought to utilize [*fr1] ounce copper for external layers where doable. +Theoretically, PCB (Printed Circuit Board) current carrying capability is decided by cross-sectional space of trace and temperature rise. moreover, cross-sectional space of trace is directly proportional to trace dimension and copper thickness. Well, here comes a question: will this rule conjointly apply to the link between current carrying capability and trace cross-sectional space, that is, is trace carrying capability directly proportional to its cross-sectional area? underneath an equivalent temperature rise that's 10°C, a 10mil-trace with 1oz copper weight is capable of withstanding current of 1amp at the most and that we rest assured that a 50mil-trace is capable of withstanding current larger than 1amp. '
New page size (new_size)
1289
Old page size (old_size)
0
Lines added in edit (added_lines)
[ 0 => 'Outer layer copper thickness necessities ought to be reviewed as trace dimension and spacing decrease below 5-6 mils. The designer ought to attempt to utilize a copper callout to satisfy the electrical necessities additionally as take into account manufacturability of the PCB. A general rule is ([1 oz. copper]https://www.allpcb.com/pcb_copper_thickness.html?code=P9 being nominal) as circuit density will increase, copper weight ought to decrease. as an example, a four mil trace and house style ought to utilize [*fr1] ounce copper for external layers where doable.', 1 => 'Theoretically, PCB (Printed Circuit Board) current carrying capability is decided by cross-sectional space of trace and temperature rise. moreover, cross-sectional space of trace is directly proportional to trace dimension and copper thickness. Well, here comes a question: will this rule conjointly apply to the link between current carrying capability and trace cross-sectional space, that is, is trace carrying capability directly proportional to its cross-sectional area? underneath an equivalent temperature rise that's 10°C, a 10mil-trace with 1oz copper weight is capable of withstanding current of 1amp at the most and that we rest assured that a 50mil-trace is capable of withstanding current larger than 1amp.' ]
All external links added in the edit (added_links)
[ 0 => 'https://www.allpcb.com/pcb_copper_thickness.html?code=P9' ]
All external links in the new text (all_links)
[ 0 => 'https://www.allpcb.com/pcb_copper_thickness.html?code=P9' ]
Links in the page, before the edit (old_links)
[]
Unix timestamp of change (timestamp)
1546569191
Retrieved from "https://freedomdefined.org/Special:AbuseLog/159429"